Alexander Kiesel

Title: Alexander Kiesel: Innovator in Electronic Assembly Cooling Solutions

Introduction

Alexander Kiesel is a notable inventor based in Erlangen, Germany. He has made significant contributions to the field of electronic assembly, particularly in the area of heat dissipation. His innovative approach addresses the challenges faced by electronic components in managing thermal energy effectively.

Latest Patents

Kiesel holds a patent for a method of dissipating heat from an electronic assembly using forced convection. This invention involves an electronic assembly that features a printed circuit board with both first and second component sides. A cooling element is positioned on the first component side, which is cooled by forced convection produced by a convection unit. The majority of electronic components are arranged on the second component side. Non-current-conducting plated-through holes are utilized to transport thermal energy generated by an electronic component from the second component side to the first component side. This thermal energy can then be transported away from the printed circuit board and dissipated through forced convection.

Career Highlights

Kiesel is currently employed at Siemens Aktiengesellschaft, where he continues to develop innovative solutions in electronic assembly. His work has been instrumental in enhancing the efficiency and reliability of electronic devices.

Collaborations

Throughout his career, Kiesel has collaborated with talented colleagues, including Fabian Diepold and Benno Weis. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Alexander Kiesel's contributions to the field of electronic assembly cooling solutions exemplify the importance of innovation in technology. His patent for dissipating heat through forced convection showcases his commitment to improving electronic component performance.