Company Filing History:
Years Active: 2025
Title: Innovations of Alexander Helmut Pfeiffenberger
Introduction
Alexander Helmut Pfeiffenberger is a notable inventor based in Toronto, Canada. He has made significant contributions to the field of chip packaging technology. His work focuses on integrating passive devices within chip packages to enhance performance and efficiency.
Latest Patents
Pfeiffenberger holds a patent for a "Chip package with core embedded integrated passive device." This innovation describes chip packages that include integrated passive devices embedded in the core of a substrate. These devices shield routings coupled to inductors from adjacent through-substrate conductive paths, such as vias. The patent outlines a chip package that features an integrated circuit (IC) die mounted to a substrate. The core of the substrate contains a plurality of inductor routing vias, signal transmission vias, and ground and power routing vias. A first integrated passive device (IPD) is strategically placed in the core to separate inductor routing vias from adjacent signal or ground/power vias.
Career Highlights
Pfeiffenberger is currently employed at Xilinx, Inc., where he continues to innovate in the field of chip technology. His work has been instrumental in advancing the capabilities of integrated circuits and chip packages.
Collaborations
One of his notable coworkers is Li-Sheng Weng, with whom he collaborates on various projects within the company.
Conclusion
Alexander Helmut Pfeiffenberger's contributions to chip packaging technology exemplify the importance of innovation in the electronics industry. His patent reflects a significant advancement in the integration of passive devices, showcasing his expertise and commitment to enhancing technology.