Alan J Emerick

Title: Alan J Emerick: Innovator in High-Density Integrated Circuit Packaging

Introduction

Alan J Emerick is a prominent inventor based in Warren Center, PA (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 10 patents. His work focuses on enhancing the performance and efficiency of electronic components, particularly in the realm of chip stacking and interconnections.

Latest Patents

One of Emerick's latest patents involves high-density integrated circuit packaging with chip stacking and via interconnections. This innovative design allows for chip stacks with decreased conductor length and improved noise immunity. The process includes laser drilling of individual chips, such as memory chips, to form conductors through metallization or conductive paste filling. These connections are made using electroplated solder preforms, ensuring robust electrical and mechanical links between the chips. The resulting high-density circuit packages can be mounted on carriers using surface mount techniques or separable connectors, and they may also take the form of removable memory modules.

Career Highlights

Emerick has had a distinguished career at International Business Machines Corporation (IBM), where he has been instrumental in advancing technology in integrated circuits. His innovative approaches have led to significant improvements in the design and functionality of electronic devices.

Collaborations

Throughout his career, Emerick has collaborated with notable colleagues, including Jerzy Maria Zalesinski and Michael A Gaynes. These partnerships have fostered a creative environment that has contributed to the development of cutting-edge technologies.

Conclusion

Alan J Emerick's contributions to the field of integrated circuit packaging have made a lasting impact on the industry. His innovative patents and collaborative efforts continue to drive advancements in technology, showcasing his dedication to improving electronic components.