Maple Grove, MN, United States of America

Al Kucera



Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2006-2008

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Al Kucera in Copper Surface Treatment

Introduction

Al Kucera, an accomplished inventor based in Maple Grove, MN, holds two patents that showcase his expertise in enhancing bonding processes through innovative methods. His work primarily focuses on improving the adhesion of copper surfaces, vital in various industrial applications.

Latest Patents

Kucera's latest patent involves a "Method for Roughening Copper Surfaces for Bonding to Substrates." This invention is directed towards creating roughened copper surfaces that are suitable for subsequent multilayer lamination. The process begins by contacting a smooth copper surface with an adhesion-promoting composition that includes an oxidizer, a pH adjuster, a topography modifier, and a uniformity enhancer. Notably, the adhesion-promoting composition does not require a surfactant, making it a more straightforward solution for industrial applications. Additional steps may include using a post-dip treatment with azole or silane compounds, further enhancing the bonding effectiveness.

Career Highlights

Kucera is a key figure at Electrochemicals, Inc., where he has directed his talents toward revolutionary approaches in surface treatment technologies. His work has not only been recognized through patents but has also contributed to the evolution of manufacturing processes involving copper substrates.

Collaborations

Throughout his career, Al Kucera has collaborated with notable coworkers such as Roger Bernards and Hector Gonzalez. These partnerships have fostered a creative environment that encourages the development of groundbreaking methods and compositions in the field of electrochemistry and surface engineering.

Conclusion

Al Kucera's inventive spirit and technical acumen have led to significant advancements in the treatment of copper surfaces, underscoring his role as a valuable contributor to the industry. As technologies continue to evolve, his patents will likely serve as a foundation for future innovations in bonding techniques.

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