This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Denki Kabushiki Kaisha. Active years: 1991.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1991
Title: Akira Yugi: Innovator in Plated Copper Alloy Materials
Introduction
Akira Yugi is a notable inventor based in Sagamihara, Japan. He has made significant contributions to the field of materials science, particularly in the development of plated copper alloy materials. His innovative work has led to the filing of a patent that showcases his expertise and creativity.
Latest Patents
Akira Yugi holds a patent for a plated copper alloy material. This invention features an undercoat plating and an overcoat plating on the copper alloy. The undercoat plating consists essentially of 0.03% to 5% by weight of zinc (Zn), with the remainder being copper (Cu). The total quantity of Zn and Cu is 98% or above, while the total quantity of other elements is 2% or below. This patent highlights his commitment to advancing material technology.
Career Highlights
Yugi is currently employed at Mitsubishi Electric Corporation, where he continues to innovate and develop new materials. His work at this esteemed company has allowed him to collaborate with other talented professionals in the field.
Collaborations
Some of his notable coworkers include Takashi Nakajima and Shinichi Iwase. Their collaborative efforts contribute to the advancement of technology and innovation within the company.
Conclusion
Akira Yugi's contributions to the field of plated copper alloy materials demonstrate his innovative spirit and dedication to material science. His patent and work at Mitsubishi Electric Corporation reflect his significant impact on the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile