Location History:
- Tenri, JP (1992 - 1993)
- Fukuyama, JP (2008 - 2009)
Company Filing History:
Years Active: 1992-2009
Title: Akio Shimoyama: Innovator in Semiconductor Technology
Introduction
Akio Shimoyama is a prominent inventor based in Fukuyama, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative work focuses on improving manufacturing processes and enhancing the efficiency of semiconductor devices.
Latest Patents
One of Shimoyama's latest patents is for a semiconductor device and manufacturing method. This method effectively suppresses the generation of burrs when an array of integrated circuits, bonded to a supporting member, is separated into chips. The process involves bonding a supporting member with thinned regions to the back side of a semiconductor substrate, followed by cutting the assembly along designated scribing lines.
Another notable patent is for a foreign matter removing mechanism, fluid flow processing equipment, and foreign matter removing method. This apparatus is designed to block off portions of a plating solution flow that are not near the liquid surface. By using a partition plate, heavy foreign substances are prevented from flowing downstream, allowing for efficient removal without relying solely on filters.
Career Highlights
Akio Shimoyama is associated with Sharp Kabushiki Kaisha Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing manufacturing techniques that enhance product quality and reliability.
Collaborations
Throughout his career, Shimoyama has collaborated with notable colleagues, including Noriki Iwasaki and Masahiko Monzen. These partnerships have contributed to the development of cutting-edge technologies in the semiconductor industry.
Conclusion
Akio Shimoyama's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in manufacturing processes and product efficiency.