Shizuoka, Japan

Akihiro Maeda


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Akihiro Maeda: Innovator in Semiconductor Adhesives

Introduction

Akihiro Maeda is a notable inventor based in Shizuoka, Japan. He has made significant contributions to the field of semiconductor technology, particularly in adhesive compositions used in semiconductor devices. His innovative work has led to the development of a patented adhesive composition that enhances the performance and reliability of semiconductor applications.

Latest Patents

Maeda holds a patent for an "Adhesive composition for semiconductor device and adhesive sheet for semiconductor device using the same." This adhesive composition comprises 10 to 30% by weight of a reactive elastomer, 40 to 65% by weight of an epoxy resin with multiple glycidyl ether groups, a phenol resin, and a curing accelerator. The unique formulation ensures a favorable ratio of the epoxy resin to the phenol resin, providing superior reflow resistance and enabling short-time, low-temperature bonding. The adhesive composition maintains essential characteristics such as heat resistance, low hygroscopicity, high adhesion, and electrical insulating properties.

Career Highlights

Maeda is associated with Tomoegawa Paper Co., Inc., where he has been instrumental in advancing adhesive technologies for semiconductor devices. His expertise in material science and engineering has positioned him as a key figure in the development of innovative solutions for the semiconductor industry.

Collaborations

Throughout his career, Maeda has collaborated with esteemed colleagues, including Naoji Suzuki and Osamu Oka. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas, further enhancing the quality of their work.

Conclusion

Akihiro Maeda's contributions to semiconductor adhesive technology exemplify the impact of innovation in the field. His patented adhesive composition not only improves the performance of semiconductor devices but also showcases the importance of collaboration in driving technological advancements.

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