Company Filing History:
Years Active: 2022
Title: Agnes Baffert: Innovator in Electronic Packaging
Introduction
Agnes Baffert is a notable inventor based in Moirans, France. She has made significant contributions to the field of electronic packaging, showcasing her innovative spirit and technical expertise. With one patent to her name, Baffert has demonstrated her ability to create solutions that enhance electronic devices.
Latest Patents
Her most recent patent is titled "Encapsulation cover for an electronic package and fabrication process." This invention features an encapsulation cover that includes a frontal wall with a through-passage extending between faces. The frontal wall is designed with an optical element that allows light to pass through the through-passage. Additionally, the cover body and a metal insert embedded within it define at least part of the frontal wall, with the cover body being overmolded over the metal insert.
Career Highlights
Agnes Baffert is currently employed at STMicroelectronics (Grenoble 2) SAS, where she continues to work on innovative projects in electronic packaging. Her role at the company allows her to collaborate with other talented professionals in the field.
Collaborations
Some of her coworkers include Karine Saxod and Veronique Ferre, who contribute to the dynamic environment at STMicroelectronics. Their collaboration fosters creativity and innovation in their projects.
Conclusion
Agnes Baffert is a pioneering inventor whose work in electronic packaging exemplifies her commitment to innovation. Her contributions are valuable to the advancement of technology in this field.