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For the Inventor, By the Inventor

Springfield, NJ, United States of America

Abraham B Cohen

USPTO Granted Patents = 34

Average Co-Inventor Count = 2.0

ph-index = 15

Forward Citations = 507(Granted Patents)


Company Filing History:

goldMedal34 out of 16,338 
 
E.i. Dupont De Nemours and Company
 patents

Years Active: 1976-1992

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34 patents (USPTO):Explore Patents
1. 5112726 - Embedded catalyst receptors for metallization of dielectrics (1992-05-12),
2. 5002855 - Solid imaging method using multiphasic photohardenable compositions (1991-03-26),
3. 4859571 - Embedded catalyst receptors for metallization of dielectrics (1989-08-22),
4. 4737446 - Method for making multilayer circuits using embedded catalyst receptors (1988-04-12),
5. 4698294 - Lamination of photopolymerizable film onto a substrate employing an (1987-10-06),
6. 4668604 - Positive-working photosensitive elements containing crosslinked beads (1987-05-26),
7. 4601970 - Dry photosensitive film containing crosslinked beads (1986-07-22),
8. 4551415 - Photosensitive coatings containing crosslinked beads (1985-11-05),
9. 4527890 - Automatic repetitive registration and imagewise exposure of sheet (1985-07-09),
10. 4522903 - Sequential automatic registration and imagewise exposure of a sheet (1985-06-11),
11. 4518667 - Automatic repetitive registration and image wise exposure of sheet (1985-05-21),
12. 4508802 - Multiple registration and imaging process to form a set of registered (1985-04-02),
13. 4414278 - Crosslinked triacrylate polymer beads (1983-11-08),
14. 4405394 - Laminating process (1983-09-20),
15. 4357413 - Dry-developing photosensitive dry film resist (1982-11-02),

Title: The Innovative Contributions of Abraham B. Cohen

Introduction: Abraham B. Cohen, based in Springfield, NJ, is a prominent inventor with an impressive portfolio of 34 patents. His work is primarily associated with E.I. du Pont de Nemours and Company, commonly known as DuPont, where he has significantly advanced technologies related to printed circuits and photohardenable compositions.

Latest Patents: Among his most recent innovations are two noteworthy patents. The first, titled "Embedded Catalyst Receptors for Metallization of Dielectrics," pertains to a laminate designed for the preparation of printed circuits that facilitates the electroless plating of conductive metals. The second patent, "Solid Imaging Method Using Multiphasic Photohardenable Compositions," details a process for forming an integral three-dimensional object from a photohardenable liquid that contains radiation-deflecting materials.

Career Highlights: Over his career, Cohen has made significant contributions to the field of materials science and engineering. His innovative approach to developing sustainable and efficient methods for circuit board manufacturing has earned him recognition in his industry and has impacted the way electronic devices are produced.

Collaborations: Throughout his career at DuPont, Cohen has collaborated with talented professionals, including Roxy N. Fan and Robert B. Heiart. These collaborations have not only fostered a creative work environment but have also led to the successful completion of numerous influential projects.

Conclusion: Abraham B. Cohen exemplifies the spirit of innovation in the field of technology and materials science. With a robust patent portfolio and a commitment to advancing industry standards, his contributions continue to shape the future of printed circuit technology and photohardenable materials.

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