Turku, Finland

Abdul Shaafi Shaikh

USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations of Abdul Shaafi Shaikh in Additive Manufacturing

Introduction

Abdul Shaafi Shaikh is a notable inventor based in Turku, Finland. He has made significant contributions to the field of additive manufacturing, particularly through his innovative work on nickel-based superalloys. His research focuses on enhancing the properties of alloys used in 3D printing, which is crucial for various industrial applications.

Latest Patents

Abdul Shaafi Shaikh holds 1 patent for his invention titled "Nickel base superalloy for additive manufacturing." This patent describes nickel alloys in powder form that comprise at least 40 wt.-% Ni, about 20.0 to 25.0 wt.-% Cr, about 5.0 to 25.0 wt.-% Co, and about 1.5 to 5.0 wt.-% Ti. The alloys have a content of B in an amount of less than 40 ppmw. These alloys provide minimal or no micro-cracks and improved ductility in creep conditions compared to similar alloys with a higher content of B when processed by additive manufacturing to create three-dimensional objects.

Career Highlights

Abdul Shaafi Shaikh is currently employed at Eos GmbH Electro Optical Systems, where he continues to advance his research in additive manufacturing technologies. His work is instrumental in developing materials that enhance the performance and reliability of 3D printed components.

Collaborations

He collaborates with esteemed colleagues such as Kevin Minet-Lallemand and Ilkka Miettunen, contributing to a dynamic research environment that fosters innovation and development in the field.

Conclusion

Abdul Shaafi Shaikh's contributions to the field of additive manufacturing through his innovative patent on nickel-based superalloys highlight his role as a leading inventor in this area. His work not only advances technology but also sets a foundation for future developments in 3D printing materials.

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