Sylvania, OH, United States of America

Aaron Teitlebaum

USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2024

Loading Chart...
Loading Chart...
1 patent (USPTO):Explore Patents

Title: Aaron Teitlebaum: Innovator in Blow-Molding Technology

Introduction

Aaron Teitlebaum is a notable inventor based in Sylvania, OH (US). He has made significant contributions to the field of blow-molding technology, particularly with his innovative designs that enhance manufacturing processes. His work is characterized by a focus on efficiency and functionality, which has garnered attention in the industry.

Latest Patents

Teitlebaum holds a patent for an "Electric heated base for container blow-molding device." This device is designed for blow molding a container from a preform. It includes a mold base and a pedestal for supporting the mold base. An electric heating element is positioned beneath the mold base to provide necessary heat, while an insulator is placed between the heating element and the pedestal to ensure optimal performance. He has 1 patent to his name.

Career Highlights

Aaron Teitlebaum is currently employed at Amcor Rigid Packaging USA, LLC, where he continues to develop innovative solutions in packaging technology. His role at Amcor allows him to apply his expertise in blow-molding processes, contributing to the company's reputation for quality and innovation in the packaging industry.

Collaborations

Throughout his career, Teitlebaum has worked alongside talented professionals, including Michael Wurster and G. David Lisch. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in packaging.

Conclusion

Aaron Teitlebaum's contributions to blow-molding technology exemplify the spirit of innovation in the manufacturing sector. His patent and ongoing work at Amcor Rigid Packaging USA, LLC highlight his commitment to advancing packaging solutions.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…