This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: A-Young Kim: Innovator in Semiconductor Technology
Introduction
A-Young Kim is a prominent inventor based in Yongin-si, South Korea. She has made significant contributions to the field of semiconductor technology, particularly in the development of innovative packaging solutions.
Latest Patents
A-Young Kim holds a patent for a semiconductor package and its manufacturing method. This invention focuses on reducing or preventing cracks from occurring in a conductive bump. The semiconductor package includes a semiconductor chip, a first conductive bump, a first re-distribution layer that connects the semiconductor chip and the first conductive bump, and a buffer structure designed to fill the space between the side surface of the first conductive bump and one surface of the first re-distribution layer. The buffer structure is notable for containing a plurality of pores, enhancing the durability of the package.
Career Highlights
A-Young Kim is currently employed at Samsung Electronics Co., Ltd., where she continues to push the boundaries of semiconductor technology. Her work has been instrumental in advancing the reliability and performance of semiconductor packages.
Collaborations
A-Young collaborates with talented colleagues, including Byung Wook Kim and Seong Won Jeong, who contribute to her innovative projects and research.
Conclusion
A-Young Kim's contributions to semiconductor technology exemplify her dedication to innovation and excellence in her field. Her patent for a semiconductor package showcases her ability to address critical challenges in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile