San Jose, CA, United States of America

A Ernesto Saldana

This inventor holds 1 USPTO granted patent. Top assignee: Ebara Technologies Incorporated. Active years: 2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: A Ernesto Saldana. Retrieved from https://idiyas.com/inventor/a-ernesto-saldana

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: A Ernesto Saldana: Innovator in CMP Technology

Introduction

A Ernesto Saldana is a notable inventor based in San Jose, CA. He has made significant contributions to the field of chemical mechanical polishing (CMP) technology. His innovative approach has led to the development of a unique apparatus and method for removing CMP polishing pads from platens.

Latest Patents

Saldana holds 1 patent for his invention titled "Apparatus and method for removing a CMP polishing pad from a platen." This invention provides a pad removal apparatus and method that enables improved pad removal from a platen, enhancing efficiency in the CMP process.

Career Highlights

Saldana is currently employed at Ebara Technologies Incorporated, where he continues to work on advancements in CMP technology. His expertise and innovative mindset have positioned him as a valuable asset to the company.

Collaborations

Throughout his career, Saldana has collaborated with talented individuals such as Cormac Walsh and Jun Liu. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

A Ernesto Saldana's contributions to CMP technology exemplify the impact of innovation in the field. His work not only advances the industry but also showcases the importance of collaboration among inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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