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For the Inventor, By the Inventor

Taipei, Taiwan

Via Technologies, Inc. of R.o.c.


USPTO Granted Patents = 2

Forward Citations = 3

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2 inventors (with patents filed for the assignee):

goldMedal Shih-Chang Ku (1 out of 18 patents)

silverMedal Hong Yang (1 out of 22 patents)


2 patents:

1. 7355849 - Non-metal mesh cover for metal chassis (2008-04-08),
2. 6980771 - CDMA wireless communication system including finite impulse response filter and phase equalizer for inter-chip interference reduction (2005-12-27),
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USPTO Data Jan 1 1976 - Jan 6 2026

2 Patents

#1,420 in Taipei

#4,113 in Taiwan

...
Taipei, Taiwan

Via Technologies, Inc. of R.o.c.

Forward Citations = 3

2 inventors:

goldMedal Shih-Chang Ku (1 out of 18 patents)

silverMedal Hong Yang (1 out of 22 patents)

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