For the Inventor, By the Inventor

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Singapore, Singapore

Stmicroelectronics Asia Pacific Pte Ltd-Singapore

USPTO Granted Patents = 1

Forward Citations = 2

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2 inventors (with patents filed for the assignee):

Kim-Yong Goh (1 out of 23 patents)

Jing-En Luan (1 out of 44 patents)

1 patent: Sort by Forward Citations

1. 8164179 - Chip scale package structure with can attachment (2012-04-24),

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USPTO Data Jan 1 1976 - Dec 30 2025

1 Patents

#835 in Singapore

#838 in Singapore

Singapore, Singapore

Stmicroelectronics Asia Pacific Pte Ltd-Singapore

Forward Citations = 2

2 inventors:

Kim-Yong Goh (1 out of 23 patents)

Jing-En Luan (1 out of 44 patents)

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