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For the Inventor, By the Inventor

Singapore, Singapore

Pep Inovation Pte. Ltd.


USPTO Granted Patents = 2

Forward Citations = 1

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1 inventor (with patents filed for the assignee):

goldMedal Jimmy Chew (2 out of 7 patents)


2 patents:

1. 11233028 - Chip packaging method and chip structure (2022-01-25),
2. 11232957 - Chip packaging method and package structure (2022-01-25),
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USPTO Data Jan 1 1976 - Dec 30 2025

2 Patents

#568 in Singapore

#569 in Singapore

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Singapore, Singapore

Pep Inovation Pte. Ltd.

Forward Citations = 1

1 inventor:

goldMedal Jimmy Chew (2 out of 7 patents)

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