For the Inventor, By the Inventor

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Cham, Switzerland

Oerlikon Assembly Equipment Ag, Steinhausen

USPTO Granted Patents = 2

Forward Citations = 15

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4 inventors (with patents filed for the assignee):

Patrick Blessing (2 out of 4 patents)

Ruedi Grueter (1 out of 4 patents)

Stefan Behler (1 out of 6 patents)

4. Dominik Werne (1 out of 2 patents)

2 patents: Sort by Forward Citations

1. 8133823 - Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate (2012-03-13),

2. 7597234 - Method for mounting a flip chip on a substrate (2009-10-06),

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USPTO Data Jan 1 1976 - Dec 16 2025

2 Patents

#29 in Cham

#2,993 in Switzerland

Cham, Switzerland

Oerlikon Assembly Equipment Ag, Steinhausen

Forward Citations = 15

4 inventors:

Patrick Blessing (2 out of 4 patents)

Ruedi Grueter (1 out of 4 patents)

Stefan Behler (1 out of 6 patents)

4. Dominik Werne (1 out of 2 patents)

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