Centurion Patentors as of November 5, 2024

Welcome to November 5, 2024. This week, we aim to celebrate the centurion patentors who have reached noteworthy milestones in their fields.

Julian Jaede

Industrial Designer at Apple.

Patent №: D1050129 (November 5, 2024) – Housing module for an electronic device.

Patent №: D1050084 (November 5, 2024) – Pair of earphones.

Yi Huang

Principal engineer at Qualcomm.

Ph.D. in wireless communications and signal processing.

Patent №: 12137436 (November 5, 2024) – Frequency hopping techniques for uplink shared channel repetitions. A user device (UE) may receive a control message from a base station specifying a frequency hopping configuration for transmitting repeated uplink channel transmissions. Based on this configuration, the UE or base station may determine a frequency hop for each transmission repetition, using either a transmission or repetition index.

Patent №: 12137066 (November 5, 2024) – DM-RS bundling for interrupted transmissions. A user device (UE) sends capability signaling information to a base station, indicating its ability to maintain coherence and bundle demodulation reference signals (DM-RS) during transmission interruptions. If the base station receives a transmission with dropped symbols, it can check this information to see if the UE maintained coherence. If so, the base station uses bundled DM-RS to decode the interrupted transmission.

Gabi Sarkis

Systems Engineer at Qualcomm.

Patent №: 12137489 (November 5, 2024) – Dynamic control of sidelink resources in a communication network.

The method includes establishing a data connection with a user device and a separate connection with a vehicle device. The network then sends an activation signal to both devices to enable a shared pool of V2X sidelink resources.

Patent №: 12137375 (November 5, 2024) – Duplication of packets associated with directional ranges. A wireless communication system includes a user equipment (UE) component designed to receive a vehicle-to-everything (V2X) packet. The UE duplicates this packet at a protocol stack layer to create multiple copies, each assigned to a specific directional range.

Chuei-Tang Wang

Technical Director, Taiwan Semiconductor Manufacturing Company Limited.

Chuei-Tang Wang received the B.S. and M.S. degrees in materials science and engineering from National Tsing Hua University, Hsinchu, Taiwan, in 1983 and 1985, respectively, and the Ph.D. from Stanford University, Stanford, CA, USA, in 1997. 

In 2000, he joined USI in Nantou, Taiwan and led the EE and packaging team for wireless connectivity SIP module design & manufacturing.

In 2011, Dr. Wang joined the TSMC Integrated Interconnect and Packaging (IIP) R&D team as a Technical Director for system architectures and electrical performance exploratory study. 

Now he is the Director of Pathfinding of System Integration (PSI) Simulation. 

In 2007, Chuei-Tang received a National Award of Industrial Technology Advancement (ITA), Taiwan, for leading connectivity SiP module development in the industry.

Patent №: 12136593 (November 5, 2024) – Electronic apparatus including antennas and directors. An electronic apparatus is described, comprising an integrated fan-out package, a dielectric housing that covers the package, and multiple conductive patterns. A gap or dielectric layer separates the housing from the package, with the conductive patterns positioned between the housing and the package.

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Angelina Kushnarova

Angelina Kushnarova (Sverediuk) was born in Ukraine. She graduated from Ternopil Medical University with a specialization in Medicine and completed an internship in Radiology at Lviv University. She worked as a Radiologist, while also working as a web developer.

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