Intel Fellow and the director of package research and systems solutions in Components Research within Technology Development at Intel Corporation.
Patent №: 12500207 – Packaging architecture with intermediate routing layers.
A 3D microelectronic assembly featuring two layers of IC dies separated by a routing layer. The interface uses hybrid bonding interconnects with an ultra-fine pitch (<10µm) to provide lateral electrical coupling between the stacked dies.
President, Chief Scientific Officer & co-Founder Regeneron Pharmaceuticals.
Patent №: 12496470 – Anti-SARS-CoV-2-spike glycoprotein antibodies and antigen-binding fragments.
Antibodies and antigen-binding fragments that specifically bind to the coronavirus spike protein. These agents are utilized in therapeutic or prophylactic methods to combat viral infections.
Research Engineer.
Patent №: 12500207 – Packaging architecture with intermediate routing layers.
A multi-layer IC assembly connecting two die layers via a high-density intermediate routing layer with <10 µm interconnect pitch.
Retired executive technologist and electrical engineer who established a distinguished career in the computer server storage sector.
A gas turbine-powered fracturing unit with a dedicated power network for auxiliary systems.
Welcome to September 9, 2025. This week, we aim to celebrate the centurion patentors who have reached noteworthy milestones in…
Welcome to September 9, 2025. This week, we aim to celebrate the centurion patentors who have reached noteworthy milestones in…
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