The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2022
Filed:
Oct. 01, 2019
Asml Netherlands B.v., Veldhoven, NL;
Adrianus Hendrik Koevoets, Mierlo, NL;
Christianus Wilhelmus Johannes Berendsen, Roermond, NL;
Rogier Hendrikus Magdalena Cortie, Ittervoort, NL;
Jim Vincent Overkamp, Eindhoven, NL;
Patricius Jacobus Neefs, Raamsdonksveer, NL;
Putra Saputra, Delft, NL;
Ruud Hendrikus Martinus Johannes Bloks, Helmond, NL;
Michael Johannes Hendrika Wilhelmina Renders, Eindhoven, NL;
Johan Gertrudis Cornelis Kunnen, Weert, NL;
Thibault Simon Mathieu Laurent, Eindhoven, NL;
ASML Netherlands B.V., Veldhoven, NL;
Abstract
A lithographic apparatuscomprisingincludesan object tablewhich carries an object. The lithographic apparatus may furthercomprise at least oneinclude asensoras part of a measurement systemto measure a characteristic of the object table, the environment surrounding the lithographic apparatus or another component of the lithographic apparatus. The measured characteristic may be used to estimatetheadeformation oftheanobject due toavaryingloadsloadduring operation of the lithographic apparatus, for exampleavaryingloadsloadinduced by a two-phase flow in a channel formedwithinofthe object table.Additionally, or alternatively, theThelithographic apparatuscomprisesmay includea predictor to estimate the deformation of the object based on a model. The positioning of the object table carrying the object can be controlled based on the estimated deformation. The positioning of a projection beam, used toprovide apatterna substrate, can be controlled relative to the object, to alter the position of the pattern and/or the projection beam on the substrate, based on the estimated deformation.