The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2021
Filed:
Apr. 24, 2019
Applicant:
Suzhou Lekin Semiconductor Co., Ltd., Taicang, CN;
Inventors:
Su Jung Jung, Seoul, KR;
Yon Tae Moon, Seoul, KR;
Young Jun Cho, Seoul, KR;
Son Kyo Hwang, Seoul, KR;
Byung Mok Kim, Seoul, KR;
Seo Yeon Kwon, Seoul, KR;
Assignee:
SUZHOU LEKIN SEMICONDUCTOR CO., LTD., Taicang, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2009.12); C09K 11/67 (2005.12); H01S 5/024 (2005.12); H01L 25/075 (2005.12); H01L 33/62 (2009.12);
U.S. Cl.
CPC ...
H01L 33/641 (2012.12); C09K 11/67 (2012.12); H01L 33/64 (2012.12); H01S 5/02469 (2012.12); H01L 25/0753 (2012.12); H01L 33/62 (2012.12); H01L 2224/32013 (2012.12); H01L 2224/45144 (2012.12); H01L 2224/48091 (2012.12); H01L 2224/73265 (2012.12); H01L 2924/01322 (2012.12); H01L 2924/12032 (2012.12);
Abstract
Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.