The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2014
Filed:
Aug. 06, 2012
Applicants:
Dae Hee Weon, Ichon-Shi, KR;
Seok Kiu Lee, Ichon-Shi, KR;
Inventors:
Dae Hee Weon, Ichon-Shi, KR;
Seok Kiu Lee, Ichon-Shi, KR;
Assignee:
Conversant IP N.B. 868 Inc., Saint John, NB, CA;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2005.12);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a semiconductor device having the steps of forming an insulating layer on a silicon substrate, forming a contact hole on the insulating layer, forming a selective silicon layer in the contact hole, and forming a selective conductive plug on the selective silicon layer.
Weon, Dae. (2014). Method of forming a contact plug for a semiconductor device (U.S. Patent No. RE45232). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/RE45232
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile