The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2013
Filed:
Oct. 22, 2009
Thomas F. Fox, Palo Alto, CA (US);
Sayeh Khalili, San Jose, CA (US);
Belgacem Haba, Saratoga, CA (US);
David Nguyen, Cupertino, CA (US);
Richard Warmke, Truckee, CA (US);
Xingchao Yuan, Palo Alto, CA (US);
Thomas F. Fox, Palo Alto, CA (US);
Sayeh Khalili, San Jose, CA (US);
Belgacem Haba, Saratoga, CA (US);
David Nguyen, Cupertino, CA (US);
Richard Warmke, Truckee, CA (US);
Xingchao Yuan, Palo Alto, CA (US);
Rambus Inc., Sunnyvale, CA (US);
Abstract
The semiconductor module is provided that includes a semiconductor housing and a plurality of integrated circuit dice positioned within the housing. The semiconductor module also includes a programmable memory device positioned within the housing and electrically coupled to the plurality of integrated circuit dice. The programmable memory device is programmable to identify the integrated circuit dice that meet a predetermined standard, such as an operating frequency requirement, or a core timing grade. Further, a method is provided for accessing a semiconductor module. The above mentioned housing is provided to enclose the plurality of integrated circuit dice and the programmable memory device. The integrated circuit dice of the plurality of integrated circuit dice that meet a predetermined standard are then identified. The programmable memory device is subsequently programmed to identify the selected integrated circuit dice.