The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2005

Filed:

Sep. 18, 1996
Applicant:

Steve W. Heppler, Boise, ID (US);

Inventor:

Steve W. Heppler, Boise, ID (US);

Assignee:

Micron Tehnology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B07C005/344 ;
U.S. Cl.
CPC ...
Abstract

There is an IC (integrated circuit) testing devicethat receives singulated ICs from a singulation station's bottom table, where an IChas slid down onto loading ramp or track. The IC will slide into test station, where stop pinhas been inserted to stop the IC in DUT (device under test) station. In the DUT station, the IC is securely held in position by an extractor bar, insertion bar, and a part guide. Thereby, test cite stationwill move downward and insert ICinto testing socket. After testing the IC, testing stationreturns upward with IC in the same secured position. Pinwill be removed to allow the IC to slide into part holding station. If the IC was not defective, pinwill be removed to allow the IC to slide onto trackof the IC separator station. While the test cite stationis in the up position a second IC is slid along trackand loaded into DUT citebeing readied for the next test cycle. However, if the first IC was found to be defective, pinwill be positioned so as to stop the IC from sliding onto track. Thereby, the test citewill proceed to the down position to test the second IC, and simultaneously pinwill be removed to now allow the defective IC to slide onto track. The second IC has now completed its testing and is ready to proceed to the remainder of the cycle.


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