The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 1995

Filed:

Apr. 25, 1993
Applicant:
Inventors:

David J Braun, St. Charles, MN (US);

Charles J Guenther, Rochester, MN (US);

James A Hagan, Rochester, MN (US);

Mark K Hoffmeyer, Rochester, MN (US);

Steven D Keidl, Rochester, MN (US);

Timothy C Daun-Lindberg, Rochester, MN (US);

John G Stephanie, Rochester, MN (US);

Vincent W Ting, Rochester, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02B / ; H05K / ;
U.S. Cl.
CPC ...
361704 ; 361688 ;
Abstract

Disclosed is a circuit board and a process for the manufacture thereof providing a circuit board comprising a metal core having parallel first and second major faces and exhibiting high thermal and electrical conductivity. The circuit board includes electrical insulating layers of thermally conductive, dielectric material applied to the first and second major faces of the metal core. Protecting the dielectric layer and copper conductors is a solder mask layer applied to the dielectric layers and forming outward facing major surfaces. A plurality of insulated and grounded vias having electrically conductive interior rings connecting the major surfaces are provided through the board. Conductive sleeves within the vias are either electrically insulated from the metal core by dielectric material or in electrical contact to the metal core for grounding.


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