The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Aug. 28, 2015
Applicant:
Ampere Computing Llc, Santa Clara, CA (US);
Inventors:
Rich Thaik, San Jose, CA (US);
Alfred Yeung, Fremont, CA (US);
April Lambert, Scotts Valley, CA (US);
Jeremy Plunkett, San Jose, CA (US);
Assignee:
Ampere Computing LLC, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03K 5/1252 (2006.01); H01L 23/525 (2006.01); H01L 23/50 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H03K 5/1252 (2013.01); H01L 23/50 (2013.01); H01L 23/525 (2013.01); H01L 23/5223 (2013.01);
Abstract
A semiconductor chip allows for a selected amount of on-die decoupling capacitance to be connected to a very-large-scale integrated circuit (VLSI) system after the circuit design is complete. The semiconductor chip comprises an integrated circuit disposed on a packaging substrate, and a power distribution network that is electrically connectable to the integrated circuit via a programmable connectivity array via the packaging substrate.