The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Dec. 24, 2014
Applicant:

Stmicroelectronics Pte Ltd, Singapore, SG;

Inventors:

Jean-Michel Grebet, Singapore, SG;

Wee Chin Judy Lim, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H04N 5/225 (2006.01); G02B 5/20 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14625 (2013.01); H01L 27/14618 (2013.01); H04N 5/2253 (2013.01); G02B 5/208 (2013.01);
Abstract

One or more embodiments disclosed herein are directed to a chip scale package camera module that includes a glass interposer between a lens and an image sensor. In some embodiments, the glass interposer is made from one or more layers of optical quality glass and includes an infrared filter coating. The glass interposer also includes electrically conductive paths to connect the image sensor, mounted on one side of the glass interposer, with other components such as capacitors, which may be mounted on a different side of the glass interposer, and the rest of the camera system. The conductive layers include traces and vias that are formed in the glass interposer in areas away from the path of light in the camera module, such that the traces and vias do not block the light between the lens and the image sensor.


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