The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Mar. 22, 2016
Applicant:

Cypress Semicondutor Corporation, San Jose, CA (US);

Inventors:

Venkatraman Prabhakar, Pleasanton, CA (US);

Krishnaswamy Ramkumar, San Jose, CA (US);

Igor Kouznetsov, San Francisco, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 27/11573 (2017.01); H01L 27/11568 (2017.01); H01L 29/06 (2006.01); H01L 21/28 (2006.01); H01L 29/423 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11573 (2013.01); H01L 21/28282 (2013.01); H01L 27/11568 (2013.01); H01L 29/0649 (2013.01); H01L 29/4234 (2013.01); H01L 21/823462 (2013.01);
Abstract

Methods of integrating complementary SONOS devices into a CMOS process flow are described. In one embodiment, the method begins with depositing a hardmask (HM) over a substrate including a first-SONOS region and a second-SONOS region. A first tunnel mask (TUNM) is formed over the HM exposing a first portion of the HM in the second-SONOS region. The first portion of the HM is etched, a channel for a first SONOS device implanted through a first pad oxide overlying the second-SONOS region and the first TUNM removed. A second TUNM is formed exposing a second portion of the HM in the first-SONOS region. The second portion of the HM is etched, a channel for a second SONOS device implanted through a second pad oxide overlying the first-SONOS region and the second TUNM removed. The first and second pad oxides are concurrently etched, and the HM removed.


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