The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Mar. 21, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Jae Hyun Lim, Suwon-si, KR;
Jong In Ryu, Suwon-si, KR;
Sung Ho Kim, Suwon-si, KR;
Jin Su Kim, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 25/16 (2006.01); H01L 23/498 (2006.01); H01L 21/78 (2006.01); H05K 1/14 (2006.01); H01L 21/56 (2006.01); H01R 12/50 (2011.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 21/78 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 24/97 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H01R 23/68 (2013.01); H01R 23/6886 (2013.01); H05K 1/14 (2013.01); H05K 1/141 (2013.01); H05K 1/144 (2013.01); H05K 1/145 (2013.01); H05K 2201/041 (2013.01); H05K 2201/042 (2013.01); H05K 2201/043 (2013.01); H05K 2201/049 (2013.01);
Abstract
In one general aspect, an electronic device module includes a first board, a first device mounted on a first surface of the first board, a second board disposed below the first board, and a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board.