The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Jun. 08, 2017
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
ADVANCED SSEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor device package includes a carrier, a first insulation layer, a capacitor element, a plurality of interconnection structures, a plurality of substantially parallel top-side metal bars, and a plurality of substantially parallel bottom-side metal bars. The first insulation layer is on the carrier and has a first surface and a second surface adjacent to the carrier and opposite to the first surface, the first insulation layer defining a plurality of through holes. The capacitor element is in the first insulation layer, the capacitor element including a top electrode and a bottom electrode. The plurality of interconnection structures are within the through holes and formed as conductive through holes. The plurality of substantially parallel top-side metal bars are on the first surface of the first insulation layer. The plurality of substantially parallel bottom-side metal bars are on the second surface of the first insulation layer.