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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9997441 B1

PDFFull Text
Date of Patent:
Jun. 12, 2018

Filed:

Jul. 28, 2015

Support member, wiring substrate, method for manufacturing wiring substrate, and method for manufacturing semiconductor package

Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventor:

Tomohiro Suzuki, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;

Attorney:

IPUSA, PLLC

Primary Examiner:

Hoa C Nguyen

Assistant Examiner:

Stanley Tso

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H05K 3/46 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5389 (2013.01); H01L 24/97 (2013.01); H05K 3/4682 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/49894 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/8149 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/85005 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92147 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1533 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

A wiring substrate includes a support member, and a wiring member formed on one side of the support member. The support member includes metal foils and at least one resin layer alternately layered, so that one of the metal foils is provided as a first outermost layer on the one side of the support member and another one of the metal foils is provided as a second outermost layer on another side of the support member. The first outermost layer includes thick and thin foils that are peelably adhered. The thick foil contacts the at least one resin layer. One surface of the thin foil faces an outer side of the support member. The wiring member includes wiring layers and an insulating layer alternately layered on the thin foil. The number of the metal foils and the number of the wiring layers are the same.

Find Patent Forward Citations

Suzuki, Tomohiro. (2018). Support member, wiring substrate, method for manufacturing wiring substrate, and method for manufacturing semiconductor package (U.S. Patent No. 9997441). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9997441

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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