The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Dec. 14, 2012
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventor:
Arnab Choudhury, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/28 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/473 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); H01L 21/4871 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/473 (2013.01); H01L 25/065 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a sacrificial microchannel material on a device, forming an overmold material on the sacrificial microchannel material, and vaporizing the sacrificial microchannel material to form microchannel structures in the overmold that are conformal to the surfaces of the device.