The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2018

Filed:

Jul. 18, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Chiahsun Tseng, Wynantskill, NY (US);

David V. Horak, Essex Junction, VT (US);

Chun-chen Yeh, Clifton Park, NY (US);

Yunpeng Yin, Niskayuna, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H01L 21/308 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3081 (2013.01); H01L 21/02244 (2013.01); H01L 21/02247 (2013.01); H01L 21/02249 (2013.01); H01L 21/02252 (2013.01); H01L 21/3086 (2013.01); H01L 21/3088 (2013.01); H01L 21/31144 (2013.01); H01L 21/67063 (2013.01); Y10T 428/24802 (2015.01);
Abstract

A metal layer is deposited over an underlying material layer. The metal layer includes an elemental metal that can be converted into a dielectric metal-containing compound by plasma oxidation and/or nitridation. A hard mask portion is formed over the metal layer. Plasma oxidation or nitridation is performed to convert physically exposed surfaces of the metal layer into the dielectric metal-containing compound. The sequence of a surface pull back of the hard mask portion, trench etching, another surface pull back, and conversion of top surfaces into the dielectric metal-containing compound are repeated to form a line pattern having a spacing that is not limited by lithographic minimum dimensions.


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