The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Mar. 10, 2016
Applicant:

Win Semiconductors Corp., Tao Yuan, TW;

Inventors:

Shu-Hsiao Tsai, Tao Yuan, TW;

Rong-Hao Syu, Tao Yuan, TW;

Yi-Ling Liu, Tao Yuan, TW;

Cheng-Kuo Lin, Tao Yuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 29/73 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/737 (2006.01); H01L 29/06 (2006.01); H01L 27/02 (2006.01); H01L 27/082 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5221 (2013.01); H01L 21/762 (2013.01); H01L 23/564 (2013.01); H01L 29/0692 (2013.01); H01L 29/42304 (2013.01); H01L 29/66242 (2013.01); H01L 29/73 (2013.01); H01L 29/737 (2013.01); H01L 29/7371 (2013.01); H01L 27/0207 (2013.01); H01L 27/0823 (2013.01);
Abstract

A layout method for compound semiconductor integrated circuits, comprising following steps of: forming a first metal layer within a first circuit layout area which intersects with a second circuit layout area at an intersection area on a compound semiconductor substrate; defining an adjacent crossover area including said intersection area and a peripheral adjacent area thereof; a first dielectric area located within said adjacent crossover area and intersected with at least part of said intersection area; forming a first dielectric block within said first dielectric area or forming said first dielectric block within said first dielectric area and a second dielectric block outside said first dielectric area, the thickness of said second dielectric block is no greater than and the thickness of at least part of said second dielectric block is smaller than the thickness of said first dielectric block; forming a second metal layer within said second circuit layout area.


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