The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Feb. 25, 2015
Applicant:

Cascade Microtech, Inc., Beaverton, OR (US);

Inventors:

Robbie Ingram-Goble, Portland, OR (US);

Michael E. Simmons, Colton, OR (US);

Philip Wolf, Beaverton, OR (US);

Ryan Garrison, Beaverton, OR (US);

Christopher Storm, Hillsboro, OR (US);

Assignee:

Cascade Microtech, Inc., Beaverton, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B25J 15/06 (2006.01); B25J 11/00 (2006.01); B25J 15/00 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); B25J 11/0095 (2013.01); B25J 15/0014 (2013.01); B25J 15/0616 (2013.01); H01L 21/67778 (2013.01); Y10S 901/40 (2013.01);
Abstract

Wafer-handling end effectors and semiconductor manufacturing devices that include and/or are utilized with wafer-handling end effectors are disclosed herein. The end effectors include an end effector body and a plurality of wafer-contacting surfaces that is supported by the end effector body and configured to form an at least partially face-to-face contact with a wafer. The end effectors further include a vacuum distribution manifold that extends between a robot-proximal end of the end effector body and the plurality of wafer-contacting surfaces. The end effectors also include a plurality of vacuum openings that is defined within the plurality of wafer-contacting surfaces and extends between the plurality of wafer-contacting surfaces and the vacuum distribution manifold. The end effectors further include a plurality of sealing structures each of which is associated with a respective one of the plurality of wafer-contacting surfaces.


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