The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2018

Filed:

Jul. 11, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Emre Alptekin, Fishkill, NY (US);

Ravikumar Ramachandran, Pleasantville, NY (US);

Viraj Y. Sardesai, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/49 (2006.01); H01L 29/66 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 29/495 (2013.01); H01L 29/456 (2013.01); H01L 29/66545 (2013.01);
Abstract

A technique relates to forming a semiconductor device. Sacrificial gates are formed on a channel region of a substrate. Epitaxial layers are grown on source-drain areas between the sacrificial gates. A contact liner and contact material are deposited. The liner and the contact material are removed from above the sacrificial gates. Contact areas are blocked with one or more masking materials and etched. The masking material is removed. The contact material is partially recessed and a nitride liner deposited. An oxide layer is deposited and the sacrificial gate is removed. A metal gate is formed on the channel region and recessed. Insulator material and metal gate material are recessed and a cap is formed over the gate.


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