The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
May. 21, 2014
Infineon Technologies Ag, Neubiberg, DE;
Christian Kuehn, Munich, DE;
Martin Bartels, Dresden, DE;
Henning Feick, Dresden, DE;
Dirk Offenberg, Dresden, DE;
Anton Steltenpohl, Munich, DE;
Hans Taddiken, Munich, DE;
Ines Uhlig, Dresden, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method for manufacturing a semiconductor device in accordance with various embodiments may include: forming an opening in a first region of a semiconductor substrate, the opening having at least one sidewall and a bottom; implanting dopant atoms into the at least one sidewall and the bottom of the opening; configuring at least a portion of a second region of the semiconductor substrate laterally adjacent to the first region as at least one of an amorphous or polycrystalline region; and forming an interconnect over at least one of the first and second regions of the semiconductor substrate.