The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 29, 2018

Filed:

Apr. 07, 2016
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

David Masayuki Ishikawa, Mountain View, CA (US);

Paul J. Steffas, Santa Clara, CA (US);

Sumedh Acharya, Bangalore, IN;

Brian H. Burrows, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/10 (2006.01); C30B 25/22 (2006.01); H01L 31/18 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); C30B 25/12 (2006.01); C30B 25/14 (2006.01); C30B 29/06 (2006.01); C23C 16/455 (2006.01); C23C 16/46 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C30B 25/22 (2013.01); C23C 16/4557 (2013.01); C23C 16/45502 (2013.01); C23C 16/45512 (2013.01); C23C 16/46 (2013.01); C30B 25/10 (2013.01); C30B 25/12 (2013.01); C30B 25/14 (2013.01); C30B 29/06 (2013.01); H01L 21/6719 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/68771 (2013.01); H01L 31/1804 (2013.01); H01L 31/1876 (2013.01); H01L 21/0262 (2013.01); H01L 21/02532 (2013.01);
Abstract

In some embodiments, an substrate processing system may include a chamber body, a heater assembly disposed within the chamber body, wherein the heater assembly includes a plurality of resistive heater elements coupled together to form an isothermal heated enclosure, and a process kit disposed within the isothermal heated enclosure and having an inner processing volume that includes a plurality of substrate supports to support substrates when disposed thereon, wherein the process kit includes a first processing gas inlet to provide processing gases to the inner processing volume, a first carrier gas inlet to provide a carrier gas to the inner processing volume, and a first exhaust outlet, and a first gas heater coupled via a first conduit to the first carrier gas inlet to heat the carrier gas prior to flowing into the inner processing volume.


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