The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
Nov. 18, 2016
Samsung Display Co., Ltd., Yongin-si, Gyeonggi-do, KR;
Ubmaterials Inc., Yongin-si, Gyeonggi-do, KR;
Byoung-Kwon Choo, Hwaseong-si, KR;
Jin-Hyung Park, Seongnam-si, KR;
Jeong-Kyun Na, Suwon-si, KR;
Joon-Hwa Bae, Suwon-si, KR;
Byoung-Ho Cheong, Yongin-si, KR;
Joo-Woan Cho, Seongnam-si, KR;
In-Sun Hwang, Suwon-si, KR;
SAMSUNG DISPLAY CO., LTD., Yongin-si, Gyeonggi-do, KR;
UBmaterials Inc., Yongin-si, Gyeonggi-do, KR;
Abstract
A polishing slurry for silicon, a method of polishing polysilicon, and a method of manufacturing a thin film transistor substrate, the slurry including a polishing particle; a dispersing agent including an anionic polymer, a hydroxyl acid, or an amino acid; a stabilizing agent including an organic acid, the organic acid including a carboxyl group; a hydrophilic agent including a hydrophilic group and a hydrophobic group, and water, wherein the polishing particle is included in the polishing slurry in an amount of about 0.1% by weight to about 10% by weight, based on a total weight of the slurry, a weight ratio of the polishing particle and the dispersing agent is about 1:0.01 to about 1:0.2, a weight ratio of the polishing particle and the stabilizing agent is about 1:0.001 to about 1:0.1, and a weight ratio of the polishing particle and the hydrophilic agent is about 1:0.01 to about 1:3.