The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Sep. 29, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Bo Qiu, Hillsboro, OR (US);

Xi Guo, Hillsboro, OR (US);

James C. Raupp, Hillsboro, OR (US);

Michael Ahrens, San Jose, CA (US);

David Pidwerbecki, Hillsboro, OR (US);

Steven J. Lofland, Portland, OR (US);

George H. Daskalakis, Forest Grove, OR (US);

Stacy L. Yee, Portland, OR (US);

Mark MacDonald, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 5/02 (2006.01); G06F 1/20 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); G06F 1/1681 (2013.01); G06F 1/203 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 5/0017 (2013.01); H05K 5/0226 (2013.01); H05K 7/20409 (2013.01); H05K 7/20963 (2013.01);
Abstract

Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.


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