The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Dec. 20, 2016
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:

Roy McLaren, Gilbert, AZ (US);

Ning Zhu, Chandler, AZ (US);

Damon G. Holmes, Scottsdale, AZ (US);

Jeffrey Kevin Jones, Chandler, AZ (US);

Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/191 (2006.01); H03F 1/56 (2006.01); H03F 3/195 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H03F 1/565 (2013.01); H01L 23/66 (2013.01); H03F 3/195 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6672 (2013.01); H03F 2200/387 (2013.01); H03F 2200/391 (2013.01); H03F 2200/451 (2013.01);
Abstract

An RF amplifier includes a transistor, a shunt circuit, an envelope frequency termination circuit, and an extra lead. The shunt circuit is coupled between a transistor current carrying terminal and a ground reference node. The shunt circuit has a shunt inductive element and a shunt capacitor coupled in series, with an RF cold point node between the shunt inductive element and the shunt capacitor. The envelope frequency termination circuit is coupled between the RF cold point node and the ground reference node. The envelope frequency termination circuit has an envelope resistor, an envelope inductive element, and an envelope capacitor coupled in series. The extra lead is electrically coupled to the RF cold point node. The extra lead provides a lead inductance in parallel with an envelope inductance provided by the envelope inductive element. An additional shunt capacitor can be coupled between the extra lead and ground.


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