The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Apr. 13, 2017
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Chia-Ching Hsu, Yunlin County, TW;

Ko-Chi Chen, Taoyuan, TW;

Shen-De Wang, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/11531 (2017.01); H01L 27/11529 (2017.01); H01L 27/11573 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11529 (2013.01); H01L 27/11531 (2013.01); H01L 27/11573 (2013.01);
Abstract

A method of fabricating a semiconductor device includes providing a substrate with a memory region and a logic region, forming a recess of the substrate in the memory region, forming a non-volatile gate stack in the recess, and forming a logic gate stack in the logic region after forming the non-volatile gate stack.


Find Patent Forward Citations

Loading…