The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
Sep. 28, 2016
Applicant:
Altera Corporation, San Jose, CA (US);
Inventors:
Loke Yip Foo, Bayan Baru, MY;
Choong Kooi Chee, Georgetown, MY;
Mei See Chin, Gelugor, MY;
Wai Ling Lee, Bayan Lepas, MY;
Wei Lun Oo, Georgetown, MY;
Assignee:
Altera Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/56 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/16145 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06572 (2013.01);
Abstract
Devices and methods related to an integrated circuit device are provided. The integrated circuit device includes a mother die and a daughter die, in which the daughter die embedded is in a substrate of the integrated circuit device. Micro bumps of the mother die and the daughter die interface together to form a direct down connection between the mother die and the daughter die.