The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
Aug. 10, 2016
Shinkawa Ltd., Tokyo, JP;
Naoki Sekine, Tokyo, JP;
Motoki Nakazawa, Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
A method of manufacturing a semiconductor device includes: a wire tail forming step of forming a wire loopbetween a first bonding point and a second bonding point with a bonding tool, and then cutting a portion of a wireextending from a tip of the bonding toolto thereby form a wire tailat the tip of the bonding tool; and a wire tail bending step of bending the wire tailso as to direct a tipof the wire tailupward by descending the bonding tooltoward the second bonding point with the wire loopformed thereat and pressing the wire tailagainst a portion of the wire looplocated above the second bonding point. Thus, the wire tail can be bent easily and efficiently.