The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
Mar. 30, 2017
Fuji Electric Co., Ltd., Kanagawa, JP;
Takafumi Yamada, Matsumoto, JP;
Hiromichi Gohara, Matsumoto, JP;
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Abstract
To bond a layered substrate and a cooling chamber having different linear expansion coefficients while preventing cracking and breaking, provided is a semiconductor module including a layered substrate formed by layering a circuit board, an insulating board, and a metal board; a semiconductor chip mounted on the circuit board; and a cooling chamber bonded to the metal board by solder. The cooling chamber includes a first board portion bonded to the metal board; a second board portion facing the first board portion; and a plurality of zigzag fins arranged between the first board portion and the second board portion. The plurality of zigzag fins are joined to the first board portion and the second board portion, and a flow path through which a coolant passes is formed by the first board portion, the second board portion, and the plurality of zigzag fins.