The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

May. 31, 2017
Applicant:

Axcelis Technologies, Inc., Beverly, MA (US);

Inventors:

Marvin Farley, Ipswich, MA (US);

Mike Ameen, Newburyport, MA (US);

Causon Ko-Chuan Jen, San Jose, CA (US);

Assignee:

Axcelis Technologies, Inc., Beverly, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/265 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01J 37/317 (2006.01); H01J 37/20 (2006.01); C23C 14/48 (2006.01); C23C 14/54 (2006.01);
U.S. Cl.
CPC ...
H01L 21/26513 (2013.01); C23C 14/48 (2013.01); C23C 14/541 (2013.01); H01J 37/20 (2013.01); H01J 37/3171 (2013.01); H01L 21/67103 (2013.01); H01L 21/67115 (2013.01); H01L 21/67742 (2013.01); H01J 2237/2001 (2013.01);
Abstract

An ion implantation system has a first chamber and a process chamber with a heated chuck. A controller transfers the workpiece between the heated chuck and first chamber and selectively energizes the heated chuck first and second modes. In the first and second modes, the heated chuck is heated to a first and second temperature, respectively. The first temperature is predetermined. The second temperature is variable, whereby the controller determines the second temperature based on a thermal budget, an implant energy, and/or an initial temperature of the workpiece in the first chamber, and generally maintains the second temperature in the second mode. Transferring the workpiece from the heated chuck to the first chamber removes implant energy from the process chamber in the second mode. Heat may be further transferred from the heated chuck to a cooling platen by a transfer of the workpiece therebetween to sequentially cool the heated chuck.


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