The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
Nov. 09, 2016
Applicant:
Renesas Electronics Corporation, Tokyo, JP;
Inventors:
Masaya Kawano, Tokyo, JP;
Yasutaka Nakashiba, Tokyo, JP;
Assignee:
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 38/14 (2006.01); H01F 27/28 (2006.01); H01F 27/40 (2006.01); H01L 23/535 (2006.01); H01L 27/12 (2006.01); H01L 49/02 (2006.01); H01L 29/06 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 38/14 (2013.01); H01F 27/2804 (2013.01); H01F 27/40 (2013.01); H01L 23/535 (2013.01); H01L 27/1203 (2013.01); H01L 28/10 (2013.01); H01L 29/0649 (2013.01); H01F 17/0013 (2013.01); H01F 2017/0086 (2013.01); H01F 2027/2809 (2013.01); H01F 2038/143 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/30107 (2013.01);
Abstract
A circuit device, includes a semiconductor substrate, and a first inductor provided over said semiconductor substrate, and a first interconnect provided over said semiconductor substrate and coupled with first inductor.