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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9977329 B1

PDFFull Text
Date of Patent:
May. 22, 2018

Filed:

Jan. 21, 2015

Negative photosensitive resin composition, cured film obtained by curing same, method for producing cured film, optical device provided with cured film, and backside-illuminated cmos image sensor

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Hirokazu Iimori, Otsu, JP;

Toshiyasu Hibino, Otsu, JP;

Mitsuhito Suwa, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

RatnerPrestia

Primary Examiner:

John A McPherson

Int. Cl.
CPC ...
G03F 7/028 (2006.01); G03F 7/075 (2006.01); G02B 5/20 (2006.01); G03F 7/027 (2006.01); G03F 7/004 (2006.01); G03F 7/031 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/26 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0757 (2013.01); G02B 5/20 (2013.01); G03F 7/0047 (2013.01); G03F 7/027 (2013.01); G03F 7/028 (2013.01); G03F 7/031 (2013.01); G03F 7/16 (2013.01); G03F 7/168 (2013.01); G03F 7/20 (2013.01); G03F 7/26 (2013.01); H01L 27/1464 (2013.01); H01L 27/14609 (2013.01); H01L 27/14621 (2013.01); H01L 27/14643 (2013.01); H01L 27/14685 (2013.01);
Abstract

The present invention provides a negative photosensitive resin composition including the following (a) to (d): (a) metallic compound particles, (b) a polysiloxane compound, (c) a compound having at least 1 group containing an α,β-unsaturated carboxylate ester structure, and (d) a photopolymerization initiator, the composition also including (e) a compound containing maleimide group.

Find Patent Forward Citations

Iimori, Hirokazu. (2018). Negative photosensitive resin composition, cured film obtained by curing same, method for producing cured film, optical device provided with cured film, and backside-illuminated cmos image sensor (U.S. Patent No. 9977329). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9977329

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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