The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
Nov. 01, 2013
Hitachi High-technologies Corporation, Tokyo, JP;
Yusuke Goto, Tokyo, JP;
Masao Kamahori, Tokyo, JP;
Hiroshi Sasaki, Tokyo, JP;
Kiyotoshi Mori, Tokyo, JP;
Hideyuki Akiyama, Tokyo, JP;
Hitachi High-Technologies Corporation, Tokyo, JP;
Abstract
A composite structure with high pressure resistance that is suitable for a flow channel is produced by reducing the number of components while maintaining the excellent chemical resistance and high stress tolerance inherent to a glass substrate and a resin substrate. A glass substrate surface is modified with a hydrolyzable silicon compound, and the glass substrate is brought into contact with the resin substrate. Subsequently, the contact surface between the glass substrate and the resin substrate is heated to a temperature from the glass transition temperature to the pyrolysis temperature of the resin substrate, eliminating gaps between the glass substrate and the resin substrate to bring them into close contact with each other, and causing chemical binding or anchor effects between the glass substrate and the resin substrate via the hydrolyzable silicon compound. Thus, the glass substrate and the resin substrate are firmly fixed to each other.