The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Sep. 13, 2016
Applicant:
Unimicron Technology Corp., Taoyuan, TW;
Inventors:
Chun-Ting Lin, Hsinchu County, TW;
Tsung-Si Wang, Hsinchu, TW;
Assignee:
Unimicron Technology Corp., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/007 (2013.01); H05K 3/064 (2013.01); H05K 3/181 (2013.01); H05K 3/188 (2013.01);
Abstract
A circuit board including a substrate, a patterned circuit layer and a photo-imaginable dielectric layer is provided. The substrate has a first surface and a second surface opposite to each other. The patterned circuit layer is disposed on the first surface, and a line width of the patterned circuit layer gradually reduces from the first surface towards the second surface. The photo-imaginable dielectric layer is disposed in the substrate corresponding to the patterned circuit layer. In addition, a manufacturing method of the circuit board is also proposed.